{"id":3907,"date":"2022-12-19T11:20:00","date_gmt":"2022-12-19T02:20:00","guid":{"rendered":"https:\/\/www.pelnox.co.jp\/blog\/?p=3907"},"modified":"2022-12-19T11:22:26","modified_gmt":"2022-12-19T02:22:26","slug":"new-gap-filler-with-high-heat-removal-effect","status":"publish","type":"post","link":"https:\/\/www.pelnox.co.jp\/blog\/en\/3907\/","title":{"rendered":"New gap filler with high heat removal effect"},"content":{"rendered":"\n
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Heat dissipation gap filler<\/strong><\/p>\n\n\n\n

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What is heat dissipation gap filler?<\/strong><\/p>\n\n\n\n

A heat-conductive resin material that is attached between components to efficiently exhaust heat generated inside equipment via a heat sink.<\/p>\n\n\n\n

This is a paste-like liquid that hardens in a curing reaction and can harden in the targeted location and in the targeted thinness.<\/p>\n<\/div>\n\n\n\n

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These are extremely effective when used in power supply units, <\/p>\n\n\n\n

communication modules, LED lighting, automotive electrical components, lithium-ion batteries, power modules, <\/p>\n\n\n\n

When used on parts that require thermal countermeasures, it can have a tremendous effect.<\/p>\n<\/div>\n<\/div>\n<\/div><\/div>\n\n\n\n

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Growing gap filler market<\/h4>\n\n\n\n
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The rapid increase in demand for electronic devices and LEDs, coupled with the miniaturization of components, requires thermal countermeasures to efficiently exhaust the heat generated inside devices.
As one approach to this, demand for thermally conductive resins inserted between components has expanded significantly.<\/p>\n\n\n\n

\u3000Among them, “heat dissipation gap filler” is increasingly being applied in place of conventional “heat dissipation sheet” and “heat dissipation grease,” and its sales volume is expected to increase by about 30% in 2023 compared to the previous year.<\/p>\n\n\n\n

In particular, the majority of the products are for automotive applications, and demand is growing due to the expansion of demand for HVs and EVs and the tailwind from the progress of in-vehicle electrification.<\/p>\n\n\n\n

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What characteristics are needed?<\/h2>\n\n\n\n
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Thermal conductivity<\/h2>\n\n\n\n

High thermal conductivity suppresses heat storage.<\/p>\n\n\n\n

It has the effect of increasing the heat removal effect.<\/p>\n<\/div>\n\n\n\n

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Flexibility and Adhesion<\/h2>\n\n\n\n

It is flexible and adheres to any part shape.<\/p>\n\n\n\n

The strong adhesion between the component and the heat-dissipating gap filler results in low thermal resistance at the adhesive interface, enabling efficient heat dissipation.<\/p>\n\n\n\n

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Pump-out and Dry-out resistance<\/h2>\n\n\n\n

It is not easily deformed or altered by heat or vibration, and can maintain the same characteristics for a long period of time.<\/p>\n\n\n\n

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Evolving <\/p>\n\n\n\n

new heat dissipation gap filler<\/p>\n<\/div>\n\n\n\n

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The mainstream heat dissipation gap filler is a material that uses silicone-based resin. However, silicone resins have various problems such as oil bleed and low molecular weight siloxane generation, which cause poor heat dissipation, short circuits, and contact failure.<\/p>\n\n\n\n

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To solve this problem, we are developing a new heat dissipation gap filler using a thermosetting type urethane resin!<\/p>\n\n\n\n

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Differences between our developed products and silicone binders<\/strong><\/p>\n\n\n\n