Product List
search result product category:One Component Type Resin
One Component Type Resin
A one-component resin product that can be used for bonding and sealing applications. Unlike ordinary epoxy products, there is no need to measure and mix two liquids, making it possible to save labor in the production line.
14 applicable
Product Name | product category | by use | by function | remark | |
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ME-5031 LC |
Resin for Car Electro Devices & Sensors
One Component Type Resin
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Standard one-component epoxy products with moderate thixotropy and excellent storage stability. | View Product Details |
ME-5064 |
Resin for Car Electro Devices & Sensors
One Component Type Resin
Environmentally Friendly Resin
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Excellent adhesion to various metals and excellent storage stability. | View Product Details |
ME-5080 LC |
Resin for Car Electro Devices & Sensors
One Component Type Resin
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One-component resin. It features low linear expansion rate and low stress. | View Product Details |
ME-5131 LC |
Resin for Car Electro Devices & Sensors
One Component Type Resin
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Strong adhesion strength to SUS and CFRP. | View Product Details |
ME-5890LC |
One Component Type Resin
Environmentally Friendly Resin
Sealing for Thermostat & Relay
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Good adhesiveness to metals, Good dimentional stability | View Product Details |
WE-2025 |
One Component Type Resin
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- | Used for magnetic powder binder and moisture-proof insulation coating. | View Product Details |
WE-3020 |
One Component Type Resin
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- | Resin for varnish and binder. Can be used with dispersed fillers. | View Product Details |
XM-5866 |
Resin for Car Electro Devices & Sensors
One Component Type Resin
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Low viscosity, Fast curable, UL-94 V-0 recongnized | View Product Details |
XM-5866 TYPE E3 |
Resin for Car Electro Devices & Sensors
One Component Type Resin
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High Thermal Conductivity, One Component Type | View Product Details |
XM-5896T |
Resin for Car Electro Devices & Sensors
One Component Type Resin
Sealing for Thermostat & Relay
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Proven performance as encapsulants for years in relay industry. It emits low outgas during curing. | View Product Details |
YC-107B |
Potting Resin for Semiconductors
One Component Type Resin
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Low viscosity, used for COB with dam | View Product Details |
ZC-203TI |
Potting Resin for Semiconductors
One Component Type Resin
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Appropriate thixotropy, Used for COB without dam | View Product Details |
ZC-206 |
Potting Resin for Semiconductors
One Component Type Resin
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Low thermal expansion, Low stress, used for COB | View Product Details |
ZC-210 |
Potting Resin for Semiconductors
One Component Type Resin
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Resin for COB with low linear expansion and high heat resistance for thin film curing. | View Product Details |
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