Product List
search result use:Semiconductor Modules
13 applicable
Product Name | product category | by use | by function | remark | |
---|---|---|---|---|---|
ME-255 TYPE T/HV-125 TYPE T |
Potting Resin for Semiconductors
Environmentally Friendly Resin
|
|
|
Halogen-free and phosphorus-free, and UL-94 V-0 certified grade | View Product Details |
ME-268 TYPE D/HV-110 TYPE D |
Potting Resin for Semiconductors
Resin for Car Electro Devices & Sensors
|
|
|
Low thermal expansion, Fast cure available, UL-94 V-0 recognized | View Product Details |
ME-269 TYPE T/HV-112 TYPE T |
Potting Resin for Semiconductors
Resin for Car Electro Devices & Sensors
|
|
|
The resin with high adhesion strength to PPS and proven performance for years in automotive industry | View Product Details |
ME-272 TYPE F/HV-136 |
Potting Resin for Semiconductors
Resin for Car Electro Devices & Sensors
|
|
|
Good resistance against Metal Corrosion and Humidity, UL-94 V-0 recognized | View Product Details |
ME-274/HV-134 |
Potting Resin for Semiconductors
Resin for Car Electro Devices & Sensors
|
|
|
High Tg, Humidity resistant potting resin for Semiconduntor module | View Product Details |
ME-276/HV-138 |
Potting Resin for Semiconductors
Resin for Car Electro Devices & Sensors
|
|
|
Extremely low cure shrinkage rate, excellent dimensional stability when heated. | View Product Details |
ME-281/HV-141 |
Potting Resin for Semiconductors
Resin for Car Electro Devices & Sensors
|
|
|
High heat resistance with Tg 200°C or higher, and excellent workability due to its low viscosity. | View Product Details |
XJS-3050 |
Conductive Adhesive
|
|
|
Low temperature [90~100℃] curable, one component type conductive adhesive [Curing condition: 100℃ 60minutes] | View Product Details |
XJS-3060-1 |
Conductive Adhesive
|
|
|
One-component conductive adhesive capable of rapid curing [150°C, 2 minutes]. | View Product Details |
YC-107B |
Potting Resin for Semiconductors
One Component Type Resin
|
|
|
Low viscosity, used for COB with dam | View Product Details |
ZC-203TI |
Potting Resin for Semiconductors
One Component Type Resin
|
|
|
Appropriate thixotropy, Used for COB without dam | View Product Details |
ZC-206 |
Potting Resin for Semiconductors
One Component Type Resin
|
|
|
Low thermal expansion, Low stress, used for COB | View Product Details |
ZC-210 |
Potting Resin for Semiconductors
One Component Type Resin
|
|
|
Resin for COB with low linear expansion and high heat resistance for thin film curing. | View Product Details |
※ You can request Sample, SDS, Composition Table and other Data Sheets etc.