CHALLENGING FORMULATOR!

NewsNews list

  • 2016.06.14 The Directors was renewed.
  • 2016.04.01 The Directors and Company Organization was renewed.
  • 2015.04.01 The Directors was renewed.
    The address of the Osaka Branch changed.
  • 2012.07.19 The effects ofPelnox's thermal radiation coating on CPV solar cells were announced by University of Miyazaki's Associate Professor Nishioka at the CPV-8 held in Spain.
  • 2012.01.10"INTERNEPCON JAPAN 2012" Exhibiting : Exhibited the Ag paste "Peltron" and heat releasing coating "Pelcool" in Internepcon Japan, held at Tokyo Big Sight from January 18-20, 2012.
    【Exhibits】 “PELTRON” New release of Ag paste applied for fine line electrode of touch panel in smart phone. The printed pattern on exhibition. “PELCOOL” lineup of a variety of countermeasures against heat issues. New lineup on hand, as high emissivity type, low temp-curing type, PCM type, metallic shade type and heat releasing adhesive sheet.
  • 2011.6.20Reliability of our heat-releasing coating '' PELCOOL H-7001 “ and its effectivity as countermeasures against heat for PV have been verified at Miyazaki University.
    The study results presented at an international conference of the concentrator photovolcanic power generation (CRV-7 Las Vegas) have been drawing attentions.
  • 2011.3.22Impact on Our Company due to the Tohoku-Kanto Great Earthquake
    We are pleased to announce the impact on us caused by the Great Eathquake as of March 18th.
  • 2011.1.19"INTERNEPCON JAPAN 2011" Exhibiting : Exhibited the electrically conductive materials "Peltron" and heat releasing coating "Pelcool" in Internepcon Japan, held at Tokyo Big Sight from January 19-21, 2011.
  • 2010.09.01Heat Releasing Coating "PELCOOL" : Developed an innovative heat releasing coating, which can avoid temperature increase simply by coating parts for which countermeasures against heat are required.

Introduction of Product Product list

Liquid Epoxy Resin Compounds

PELNOX
Insulating Resin for Various Electronic Components, Opto Devices and Car Electronics Devices

PELCOAT
Dipping Paint for Capacitors, Hybrid ICs and Sensors

EPOTACK
Adhesive Resin for Fluoro-Rubber and Sealing Thermostats and Sensors

Polyurethane Resin Compounds

PEL-URETHANE
Polyurethane Resin for Protective Insulating of Various Electronic Circuits and Electronic Components and for Vacuum Casting

Epoxy Coating Powder

PEL-POWDER
Epoxy Resin Powder Coating for Insulating of Electronic Components, and Anticorrosive and Antirust treatment for Metallic Parts

Silicone Paint

SILOX
Silicone Based Heat Resistant Paint for Insulating Protective Coatings of Electronic Components and Devices

Conductive Paste

PELTRON (K, S Series)
Electrically-Conductive Paste for Circuits, Electrodes and Conductive Bonding

Fuctional Coating

PELTRON (C, A Series)
Antistatic / Antifouling Coatings

New ProductsIntroduction of Newly Developped Products

PELCOOL
One Component Heat Curing Type Heat Releasing Coating

Head Office/R&D Center
Head Office/R&D Center

Bodai,Sone Factory
Bodai and Soya Factory