In the process of curing from a liquid to a solid, such as epoxy resins, shrinkage generally occurs in two stages.
① Reaction shrinkage, which occurs due to changes in cross-link density caused by chemical reactions.
② Thermal shrinkage, which occurs when the material cools down from a high temperature cure or reaction heat to room temperature.
Cure shrinkage is a phenomenon in which the cured material cured through the processes ① and ② shrinks from the volume of the liquid (at room temperature) before curing. Generally, encapsulation with epoxy resin, which has large cure shrinkage, causes residual stress after curing, which may lead to defects such as warpage and package deformation.
We propose suitable products to suppress cure shrinkage according to the customer’s application.
