Resins with high modulus of elasticity have hard properties. However, they are susceptible to cracking due to stress generated by impact or heat.
To solve this drawback, the elastic modulus is lowered and the resin has a stress-relieving effect, which is called low-stress resin.
It can provide resistance to the thermal stresses that occur during heat cycling and resistance to external impacts.
Low stress can be achieved by reducing the cross-link density of the resin or by blending stress-relieving agents such as rubber particles into the resin.
We offer epoxy products such as XM-2437/HY-690 and ME-276/HV-138 as low-stress encapsulants.
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