Plating is a technology that covers the surface state of a material with a metallic film. Plating is used to add various functions, such as electrical conductivity and solder wettability. This type of functionality is mainly used for electronic components such as MLCCs and chip inductors. Although our silver pastes have low silver content, they are designed to have a large amount of silver present on the top surface of the cured coating film, making it easy to form plating and providing high adhesion with the plating.
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