・Non-silicone product, free of siloxane.
・Two-component, heat-curable resin
・Advanced kneading technology and the selection of appropriate liquid resins enable High thermal conductivity with a large amount of inorganic filler material.
・Storage stability is greatly improved by selecting the purity of inorganic fillers.
・Despite the high filler content, the product is in liquid form with good flowability.
One of the best thermal solutions! Lineup of high thermal conductive flexible resins
・Adhesives/encapsulants for sensors for various vehicles
・Encapsulants for components that generate heat