・One-component type that does not require mixing of epoxy resin and curing agent.
・Heat curing is completed in a few minutes to a dozen minutes.
・Cured physical properties that can withstand various types of reliability, such as reflow soldering.
Fast-curing, one-component, heat-curing epoxy adhesive
【Example of use】
・Bonding and fixing of various electronic components
・Temporary fixing of small electronic components