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【Features of heat-resistant epoxy encapsulating resin】

・Two-component, heat-curable epoxy resin

・High Tg is achieved by selecting heat-resistant epoxy resin/hardener.

・Low expansion coefficient due to large amount of inorganic fillers by using advanced kneading technology.

・Power cycle performance is improved and long-term reliability is enhanced.

・Optimization of particle size distribution of inorganic filler material provides good workability and viscosity.

【Applications】

・Encapsulant for power modules for vehicles and industrial equipment

・Adhesives/encapsulants for sensors for various vehicles