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Fast-curing, one-component, heat-curing epoxy adhesive

【Product Features】

・One-component type that does not require mixing of epoxy resin and curing agent.

・Heat curing is completed in a few minutes to a dozen minutes.

・Cured physical properties that can withstand various types of reliability, such as reflow soldering.

【Example of use】

・Bonding and fixing of various electronic components

・Temporary fixing of small electronic components

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