Product Details

Specification

Features

• High heat resistance
• Low temperature curability

by Use

• Potting resin for resistors and other sensors

Types of packaging

Instructions for Use

1. Add the solvent and stir well with an agitator.
2. Add a diluent to adjust the viscosity to a level that is easy to work with.
3. Pour the mold into a case or other container. Pour the mold in several times if necessary.
4. Air dry at room temperature to remove solvent thoroughly. If a large amount of solvent remains, it may cause swelling.
5. Curing should be done under the specified curing conditions.