・Condensation curing type
・Methyl silicone type
・One-component
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Product Details
DS-8100-2H
Specification
- High adhesion strength
- High light transmittance
- No cure inhibition from N, P, S, etc.
Features
- Die bond adhesive for LED
by Use
Types of packaging
DS-8100-2H : 10g
Instructions for Use
- The product is to be stored refrigerated or frozen. Please bring to room temperature before opening the package. Condensation may cause moisture to enter the product.
- Set the product in the dispenser and apply it to the substrate.
- Curing should be done under the specified curing conditions.
