Used for Chip LED, Low stress
| Product Category | by Use | by Function | |||
|---|---|---|---|---|---|
| Product Category |
|
by Use |
|
by Function |
|
Product Details
ME-540/HV-540
Specification
- Two-component heat-curing epoxy resin
- Acid anhydride curing agent
- Non-filler
- Low stress and good heat shock resistance
- Good adhesion
Features
- Encapsulants for LEDs (chip-type LEDs)
by Use
Types of packaging
ME-540 : 1kg
HV-540 : 1kg
Instructions for Use
- The ingredients may separate or the filler may settle. Stir well before use.
- Calculate the required main and hardening agents based on the mixing ratios listed in the product information.
- Measure the main agent and hardener into a polyethylene cup.
- Mix the main agent and hardener well. Use a stirrer or spatula for mixing.
- When stirring, make sure to agitate the corners and bottom of the cup.
- Defoam the mixed liquid immediately after stirring. Insufficient defoaming may cause air bubbles.
- Pour or apply the mixture.
- Curing should be done under the specified curing conditions.
- Do not cure a large amount at a time. Failure to do so may result in smoking or ignition.
