Product Details


Used for Chip LED, Low stress

Product Category by Use by Function
Product Category
  • Casting Resin for LED
by Use
  • LED
by Function
  • Low Stress
  • Heat Cycle Resistant



  • Two-component heat-curing epoxy resin
  • Acid anhydride curing agent
  • Non-filler
  • Low stress and good heat shock resistance
  • Good adhesion

    by Use

  • Encapsulants for LEDs (chip-type LEDs)

Types of packaging

ME-540 : 1kg
HV-540 : 1kg

Instructions for Use

  1. The ingredients may separate or the filler may settle. Stir well before use.
  2. Calculate the required main and hardening agents based on the mixing ratios listed in the product information.
  3. Measure the main agent and hardener into a polyethylene cup.
  4. Mix the main agent and hardener well. Use a stirrer or spatula for mixing.
  5. When stirring, make sure to agitate the corners and bottom of the cup.
  6. Defoam the mixed liquid immediately after stirring. Insufficient defoaming may cause air bubbles.
  7. Pour or apply the mixture.
  8. Curing should be done under the specified curing conditions.
  9. Do not cure a large amount at a time. Failure to do so may result in smoking or ignition.