Challenge to even higher temperatures! Heat resistant epoxy resin is the solution to improve the functionality of parts.

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Heat Resistant Resin

A resin that can maintain the same performance at
high temperatures for an extended period of time is
all that is needed.

XM-3536-2/XV-3537-1 was developed to solve
this problem.

For power semiconductor modules, automotive devices, and components requiring high heat resistance

We are pleased to introduce our latest product lineup, which has undergone a series of improvements.

Download Technical Data for Developed Products

Download Technical Documents of
XM-3536-2/XV-3537-1

A product specialized for heat resistance, resistant to resin cracking, and a perfect match for ceramics and copper!
Detailed technical data, including long-term reliability data and competitive product comparison data, can be found here.

Download Technical Documents of
XM-3568-2/XV-3569

Specialized in heat resistance, low viscosity, and excellent processability. Even complex shapes can be easily sealed!
Click here for detailed technical data such as viscosity.

Download Technical Documents of
XM-3576/XV-3569

Specialized in heat resistance and also flame retardant!
Detailed technical data, including long-term reliability data, can be found here.

Improve the performance of parts.
That can be solved with heat resistant resins.


The next generation of
electronic components will evolved to be smaller and thinner.

There, large currents flow and heat is generated, and The performance degradation of components is an issue.

Peeling of wires, cracks in sealing resin, warping or warping of parts, etc…

The only thing needed is
a resin that can maintain the same performance at high temperatures for a long time.

To improve the performance of next-generation components.

Our high heat-resistant, high-performance encapsulating resin
“XM-3536-2/XV-3537-1 “will solve
your problem.

Heat resistant resin exclusively for encapsulants
PELNOX® XM-3536-2 / PELCURE® XV-3537-1

Functional Properties

The developed product, XM–3536-2/XV-3537-1,
is resistant to heat and its functional characteristics
do not change even under severe environments.
These six characteristics support the next generation of high-performance components.

Not just heat resistant.
Necessary functions can also be added.

The features of our heat resistant epoxy resins are not limited to it.

We have newly added easy-to-handle low viscosity and flame retardant types to our lineup in response to customer demand.

Although these products are under development, they are being evaluated in a variety of applications and have been very well received.

Technical data documents for each product can be downloaded from the button below.

Samples are also available free of charge, so please feel free to contact us for more information.

Table of physical properties of New developed product lineup

Download Technical Documents of
XM-3536-2/XV-3537-1

Individual technical data, including long-term reliability data and competitive product comparison data, can be found here.

Download Technical Documents of
XM-3568-2/XV-3569

Property data, including viscosity, can be found here.

Download Technical Documents of
XM-3576/XV-3569

Detailed data, including flame retardant data and long-term reliability data, can be found here.

About Inventory Information

*Survey results as of Sep. 2022
*This is our research, please use it as reference information.
*Please feel free to contact us for exports to countries or regions not listed on this table.

Message from the Developer

Mr. Kajitani, Development 1Gr.

Thank you for visiting our blog.
I am Kajitani, the developer.

Our team has been working on this product for three years, repeatedly making prototypes until we were satisfied with it.

The temperature at which SiC power semiconductor modules are produced in recent years is said to be as high as 200℃.
We have designed our products to have the features of “long-term heat resistance,” “low viscosity,” “low elasticity,” and “high adhesiveness”.

We believe that this developed product is a material that can actively play a role in sensors, motors, and power supplies that are required under high temperatures, in addition to SiC power semiconductor modules.
We hope that you will evaluate this product.

Click here to inquire about our products or
request a sample.

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Please feel free to contact us You can request Sample, SDS, Composition Table and other Data Sheets etc.

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