Heat dissipation gap filler What is heat dissipation gap filler? A heat-conductive resin material that is attached between components to efficiently exhaust heat generated inside equipment via a heat sink. This is a paste-like liquid that hardens in a curing reaction and can harden in the targeted location and in the targeted thinness. These are […]
Read moreDownload Technical Data for Developed Products Download Technical Documents ofXM-3536-2/XV-3537-1↗ A product specialized for heat resistance, resistant to resin cracking, and a perfect match for ceramics and copper!Detailed technical data, including long-term reliability data and competitive product comparison data, can be found here. Download Technical Documents ofXM-3568-2/XV-3569↗ Specialized in heat resistance, low viscosity, and excellent […]
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Development Opportunity Request for shorter curing time for thermosetting resin products In recent years, cost reduction through productivity improvement has become more and more important in order to strengthen competitiveness.We have received many requests for shorter curing times for our thermosetting resin products. For example, general thermosetting epoxy resins require at least several tens of […]
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