NEW / PICK UP PRODUCTS

Product Lineup for Medical Device Electronic Component Applications

【Product Features】


◆ME-105/XH-1716-1
 ・ Two-component epoxy adhesive capable of room temperature curing.  
 ・Ideal for bonding and sealing components with low heat resistance.


◆MU-642A/B
 ・Non-yellowing, light-guiding urethane resin. 
 ・High transparency, flexibility, and bendability.


◆K-3330
 ・Thermosetting conductive paste with excellent fine line printability and contact resistance change.
 ・Excellent change in contact resistance after endurance testing due to improved surface smoothness.


◆XJS-3066A/B
 ・ Two-component conductive adhesives with a 1:1 mixing ratio for easy handling  
・ Room temperature curing is possible, making it ideal for bonding electrical materials with low heat resistance.


◆XJK-0408
 ・One-component silver/silver chloride paste for continuous screen printing.
 

*Test items in ISO 10993 (biocompatibility standard) are not performed.