Product Details


Suitable for formation of end-face electrodes on chip components, applied by dip coating process. It is unique that this special formulation makes a hardened coating film higher conductivity even with less silver content.

Product Category by Use by Function
Product Category
  • Electrically conductive Paste for Electrodes
by Use
  • Car Electro Devices
  • Ceramic Capacitors
  • Small Components Electrode
by Function
  • One Component
  • Heat Resistant
  • Heat Cycle Resistant
  • Good Plating Property



  • Low silver content
  • For dip coating
  • One-component
  • Heat resistance
  • Heat cycle resistance
  • Good plating adhesion

    by Use

  • Stress relief of chip components
  • Plating base

Types of packaging

XJK-0390A : 1kg

Instructions for Use

  1. The ingredients may separate or the filler may settle. Stir well before use.
  2. Add a diluent to adjust the viscosity to a level that is easy to work with.
  3. Apply it to the base material using a painting machine.
  4. Curing should be done under the specified curing conditions.