Product Details

XJS-3050

Low temperature [90～100℃] curable, one component type conductive adhesive [Curing condition: 100℃ 60minutes]

Product Category by Use by Function
Product Category
  • Conductive Adhesive
by Use
  • Semiconductor Modules
  • Car Electro Devices
  • General Modules
  • Die Attach
  • Solar Batterys
 by Function
  • One Component
  • Low Temperature Curing
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Specification

    Features

  • One-component
  • Low temperature (80℃) curing
  • High adhesion strength

    by Use

  • Bonding lead terminals

Instructions for Use

  1. The ingredients may separate or the filler may settle. Stir well before use.
  2. Add a diluent to adjust the viscosity to a level that is easy to work with.
  3. Apply it to the base material using a painting machine.
  4. Curing should be done under the specified curing conditions.
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