Product Details


Low viscosity, used for COB with dam

Product Category by Use by Function
Product Category
  • Potting Resin for Semiconductors One Component Type Resin
by Use
  • Semiconductor Modules
  • General Modules
by Function
  • One Component



  • Low viscosity and good workability
  • Acid anhydride curing one-component encapsulating resin
  • Suitable for dam or case type

    by Use

  • Encapsulants for semiconductors

Types of packaging


Instructions for Use

  1. The product is to be stored refrigerated or frozen. Please bring to room temperature before opening the package. Condensation may cause moisture to enter the product.
  2. The ingredients may separate or the filler may settle. Stir well before use.
  3. Make sure to defoam thoroughly. Insufficient defoaming may cause bubbles.
  4. Pour or apply.
  5. Curing should be done under the specified curing conditions.
  6. Be careful not to harden a large amount at one time, as it may cause high temperatures that may result in smoking or ignition.