Product Details


High heat resistance with Tg 200°C or higher, and excellent workability due to its low viscosity.

Product Category by Use by Function
Product Category
  • Potting Resin for Semiconductors Resin for Car Electro Devices & Sensors 
by Use
  • Semiconductor Modules
  • Car Electro Devices
  • Sensors, Relays
by Function
  • Heat Resistant
  • High Tg
  • Heat Cycle Resistant



  • Two-component heat-curing epoxy resin
  • Acid anhydride curing agent
  • Heat-resistant against 200℃
  • High Tg (200℃)
  • Heat cycle resistance
  • Moisture resistance
  • Moisture resistance
  • ATF resistance
  • Low viscosity (10,000 mPa-s at 25 °C) compared to conventional products

    by Use

  • Potting for semiconduntor modules
  • Automotive electrical components
  • Sensors, relays

Instructions for Use

  1. The ingredients may separate or the filler may settle. Stir well before use.
  2. Calculate the required main and hardening agents based on the mixing ratios listed in the product information.
  3. Measure the main agent and hardener into a polyethylene cup.
  4. Mix the main agent and hardener well. Use a stirrer or spatula for mixing.
  5. When stirring, make sure to agitate the corners and bottom of the cup.
  6. Defoam the mixed liquid immediately after stirring. Insufficient defoaming may cause air bubbles.
  7. Pour or apply the mixture.
  8. Curing should be done under the specified curing conditions.
  9. Do not cure a large amount at a time. Failure to do so may result in smoking or ignition.