Product Details


Low thermal expansion, Fast cure available, UL-94 V-0 recognized

Product Category by Use by Function
Product Category
  • Potting Resin for Semiconductors Resin for Car Electro Devices & Sensors 
by Use
  • Semiconductor Modules
  • Car Electro Devices
  • Sensors, Relays
by Function
  • Heat Resistant
  • Flame Resistant (UL-94 V-0)
  • Heat Cycle Resistant



  • Two-component heat-curing epoxy resin
  • Acid anhydride curing agent
  • Heat resistance
  • Flame resistance (UL-94, V-0 certified)
  • Heat cycle resistance

    by Use

  • Potting for semiconduntor modules
  • Automotive electrical components
  • Sensors, relays

Types of packaging

ME-268 TYPE D : 5kg
HV-110 TYPE D : 5kg

Instructions for Use

  1. The ingredients may separate or the filler may settle. Stir well before use.
  2. Calculate the required main and hardening agents based on the mixing ratios listed in the product information.
  3. Measure the main agent and hardener into a polyethylene cup.
  4. Mix the main agent and hardener well. Use a stirrer or spatula for mixing.
  5. When stirring, make sure to agitate the corners and bottom of the cup.
  6. Defoam the mixed liquid immediately after stirring. Insufficient defoaming may cause air bubbles.
  7. Pour or apply the mixture.
  8. Curing should be done under the specified curing conditions.
  9. Do not cure a large amount at a time. Failure to do so may result in smoking or ignition.