Product Details

Specification

Features

• Low viscosity and good workability
• Acid anhydride curing one-component encapsulating resin
• Suitable for dam or case type

by Use

• Encapsulants for semiconductors

Types of packaging

Instructions for Use

1. The product is to be stored refrigerated or frozen. Please bring to room temperature before opening the package. Condensation may cause moisture to enter the product.
2. The ingredients may separate or the filler may settle. Stir well before use.
3. Make sure to defoam thoroughly. Insufficient defoaming may cause bubbles.
4. Pour or apply.
5. Curing should be done under the specified curing conditions.
6. Be careful not to harden a large amount at one time, as it may cause high temperatures that may result in smoking or ignition.