Product Details

Specification

Features

• Two-component room temperature curing epoxy resin
• Amine-based curing agents
• Low stress
• Low temperature curing

by Use

• Potting for semiconduntor modules
• Automotive electrical components
• Sensors, relays

Types of packaging

Instructions for Use

1. The ingredients may separate or the filler may settle. Stir well before use.
2. Calculate the required main and hardening agents based on the mixing ratios listed in the product information.
3. Measure the main agent and hardener into a polyethylene cup.
4. Mix the main agent and hardener well. Use a stirrer or spatula for mixing.
5. When stirring, make sure to agitate the corners and bottom of the cup.
6. Defoam the mixed liquid immediately after stirring. Insufficient defoaming may cause air bubbles.
7. Pour or apply the mixture.
8. Curing should be done under the specified curing conditions.
9. Do not cure a large amount at a time. Failure to do so may result in smoking or ignition.