Product Details

ZC-210

Resin for COB with low linear expansion and high heat resistance for thin film curing.

Product Category by Use by Function
Product Category
  • Potting Resin for Semiconductors One Component Type Resin
by Use
  • Semiconductor Modules
  • General Modules
by Function
  • One Component
  • Low Stress
  • Low Curing Shrinkage
  • Low Warpage

Specification

    Features

  • Acid anhydride system
  • Delivered in syringes
  • High glass transition temperature (175℃)
  • Low linear expansion coefficient (15ppm/℃)
  • Good coatability

    by Use

  • Thin-film adhesives

Types of packaging

ZC-210 : 30g(syringe)

Instructions for Use

  1. The product is to be stored refrigerated or frozen. Please bring to room temperature before opening the package. Condensation may cause moisture to enter the product.
  2. The ingredients may separate or the filler may settle. Stir well before use.
  3. Make sure to defoam thoroughly. Insufficient defoaming may cause bubbles.
  4. Pour or apply.
  5. Curing should be done under the specified curing conditions.
  6. Be careful not to harden a large amount at one time, as it may cause high temperatures that may result in smoking or ignition.