Product List

search result product category：Potting Resin for Semiconductors

Potting Resin for Semiconductors

Epoxy resins are used to encapsulate the components that generate heats, such as rectifier elements and power modules. We have the grade of epoxy encapsulants that are compatible with bare die on subsrate. In recent years, we have prepared epoxy encapsulant with heat resistance against 200°C for SiC modules.

11 applicable

Product Name	product category	by use	by function	remark
ME-255 TYPE T/HV-125 TYPE T	Potting Resin for Semiconductors Environmentally Friendly Resin	Semiconductor Modules Car Electro Devices	Heat Resistant Flame Resistant (UL-94 V-0) Environmentally Friendly	Halogen-free and phosphorus-free, and UL-94 V-0 certified grade	View Product Details
ME-268 TYPE D/HV-110 TYPE D	Potting Resin for Semiconductors Resin for Car Electro Devices & Sensors	Semiconductor Modules Car Electro Devices Sensors, Relays	Heat Resistant Flame Resistant (UL-94 V-0) Heat Cycle Resistant	Low thermal expansion, Fast cure available, UL-94 V-0 recognized	View Product Details
ME-269 TYPE T/HV-112 TYPE T	Potting Resin for Semiconductors Resin for Car Electro Devices & Sensors	Semiconductor Modules Car Electro Devices Sensors, Relays	Heat Resistant Flame Resistant (UL-94 V-0) Heat Cycle Resistant	The resin with high adhesion strength to PPS and proven performance for years in automotive industry	View Product Details
ME-272 TYPE F/HV-136	Potting Resin for Semiconductors Resin for Car Electro Devices & Sensors	Semiconductor Modules Car Electro Devices Sensors, Relays	Heat Resistant Flame Resistant (UL-94 V-0) Heat Cycle Resistant Moisture Resistant	Good resistance against Metal Corrosion and Humidity, UL-94 V-0 recognized	View Product Details
ME-274/HV-134	Potting Resin for Semiconductors Resin for Car Electro Devices & Sensors	Semiconductor Modules Car Electro Devices Sensors, Relays	Heat Resistant Flame Resistant (UL-94 V-0) High Tg Heat Cycle Resistant Moisture Resistant	High Tg, Humidity resistant potting resin for Semiconduntor module	View Product Details
ME-276/HV-138	Potting Resin for Semiconductors Resin for Car Electro Devices & Sensors	Semiconductor Modules Car Electro Devices Sensors, Relays	Heat Resistant High Tg Heat Cycle Resistant Moisture Resistant	Extremely low cure shrinkage rate, excellent dimensional stability when heated.	View Product Details
ME-281/HV-141	Potting Resin for Semiconductors Resin for Car Electro Devices & Sensors	Semiconductor Modules Car Electro Devices Sensors, Relays	Heat Resistant High Tg Heat Cycle Resistant	High heat resistance with Tg 200°C or higher, and excellent workability due to its low viscosity.	View Product Details
YC-107B	Potting Resin for Semiconductors One Component Type Resin	Semiconductor Modules General Modules	One Component	Low viscosity, used for COB with dam	View Product Details
ZC-203TI	Potting Resin for Semiconductors One Component Type Resin	Semiconductor Modules General Modules	One Component Flame Resistant (UL-94 V-0)	Appropriate thixotropy, Used for COB without dam	View Product Details
ZC-206	Potting Resin for Semiconductors One Component Type Resin	Semiconductor Modules General Modules	One Component Low Stress Low Curing Shrinkage Low Warpage Heat Cycle Resistant	Low thermal expansion, Low stress, used for COB	View Product Details
ZC-210	Potting Resin for Semiconductors One Component Type Resin	Semiconductor Modules General Modules	One Component Low Stress Low Curing Shrinkage Low Warpage	Resin for COB with low linear expansion and high heat resistance for thin film curing.	View Product Details

※ You can request Sample, SDS, Composition Table and other Data Sheets etc.