Product List

search result function：One Component

31 applicable

Product Name	product category	by use	by function	remark
AT17-S	UV Curable Resins	Car Electro Devices Sensors, Relays General Modules	One Component Flexible Low Stress Low Temperature Curing Environmentally Friendly Fast Curing UV Curing	White colored UV-curable protective coating with moderate softness at room temperature so that it can be applied to flexible substrates.	View Product Details
DS-8100-2H	Silicone Resin for Optical Devices	LED Die Attach	One Component	・Condensation curing type ・Methyl silicone type ・One-component	View Product Details
K-3100	Electrically conductive Paste for Circuit Patterns	General Modules Touch Panels Solar Batterys	One Component Low Resistance	Suitable mainly for conductive circuits on capacitive touch panels.	View Product Details
K-3105	Electrically conductive Paste for Circuit Patterns	General Modules Touch Panels Solar Batterys	One Component Low Resistance	Suitable mainly for conductive circuits on resistive touch panels.	View Product Details
K-3107S	Electrically conductive Paste for Circuit Patterns	General Modules Touch Panels Solar Batterys	One Component Low Resistance	Suitable mainly for conductive circuits on resistive touch panels.	View Product Details
K-3202	Electrically conductive Paste for Electrodes	Car Electro Devices Ceramic Capacitors Small Components Electrode	One Component Heat Resistant Heat Cycle Resistant Good Plating Property	Suitable for formation of end-face electrodes on chip components, applied by stamp transfering process.	View Product Details
K-3205	Electrically conductive Paste for Electrodes	Car Electro Devices Ceramic Capacitors Small Components Electrode	One Component Heat Resistant Heat Cycle Resistant Good Plating Property	Suitable for end-face electrodes on various chip components, with solvent, applied by screen printing or dip coating process.	View Product Details
K-3330	Electrically conductive Paste for Circuit Patterns	General Modules Touch Panels Solar Batterys	One Component Flexible Bending Resistant For Fine Line Printing	Capable of forming fine line circuits by screen printing. Mainly suitable for conductive circuits on capacitive touch panels.	View Product Details
K-3981	Silver chloride paste for biosensors	Biosensors Small Components Electrode	One Component Flexible Bending Resistant Long Potlife	Silver Silver chloride ratio = 90:10 Suitable mainly in ECG and EEG electrode applications. Screen printing is a suitable coating method.	View Product Details
ME-5000	Casting Resin for LED	LED Die Attach	One Component	One-component and non-conductive die attach adhesive for LEDs. (Color: White)	View Product Details
ME-5031 LC	Resin for Car Electro Devices & Sensors　 One Component Type Resin	Car Electro Devices General Modules	One Component Low Stress Low Curing Shrinkage	Standard one-component epoxy products with moderate thixotropy and excellent storage stability.	View Product Details
ME-5064	Resin for Car Electro Devices & Sensors　 One Component Type Resin Environmentally Friendly Resin	Car Electro Devices Sensors, Relays General Modules	One Component Low Stress Long Potlife Impact Resistant Stress Release	Excellent adhesion to various metals and excellent storage stability.	View Product Details
ME-5080 LC	Resin for Car Electro Devices & Sensors　 One Component Type Resin	Sensors, Relays Thermal Fuses	One Component Low Stress Low Curing Shrinkage Low Warpage Impact Resistant Stress Release	One-component resin. It features low linear expansion rate and low stress.	View Product Details
ME-5131 LC	Resin for Car Electro Devices & Sensors　 One Component Type Resin	Car Electro Devices Sensors, Relays General Modules	One Component Low Temperature Curing Moisture Resistant Fast Curing	Strong adhesion strength to SUS and CFRP.	View Product Details
ME-5890LC	One Component Type Resin Environmentally Friendly Resin Sealing for Thermostat & Relay	Thermal Fuses	One Component	Good adhesiveness to metals, Good dimentional stability	View Product Details
R-5039	Protective Paste for Chip Components	Car Electro Devices Ceramic Capacitors Small Components Electrode	One Component Moisture Resistant	Protective coating paste for chip components. Screen printing is recommended as the application method. Excellent moisture and heat resistance acquired, and when used as a protective film for chip resistors, it can significantly help suppressing value changes in resistance.	View Product Details
R-5040	Protective Paste for Chip Components	Car Electro Devices Ceramic Capacitors Small Components Electrode	One Component Moisture Resistant	Protective coating paste for chip components. Screen printing is recommended as the application method. Excellent moisture and heat resistance acquired, and when used as a protective film for chip resistors, it can significantly help suppressing value changes in resistance.	View Product Details
XJK-0390A	Electrically conductive Paste for Electrodes	Car Electro Devices Ceramic Capacitors Small Components Electrode	One Component Heat Resistant Heat Cycle Resistant Good Plating Property	Suitable for formation of end-face electrodes on chip components, applied by dip coating process. It is unique that this special formulation makes a hardened coating film higher conductivity even with less silver content.	View Product Details
XJK-0495	Silver chloride paste for biosensors	Biosensors Small Components Electrode	One Component Flexible Bending Resistant Long Potlife	Silver Silver chloride ratio = 60:40 Suitable mainly for standard electrode applications for ECG and electrotherapy. Screen printing is a suitable coating method.	View Product Details
XJK-0496	Silver chloride paste for biosensors	Biosensors Small Components Electrode	One Component Flexible Bending Resistant Long Potlife	Silver Silver chloride ratio = 50:50 Suitable mainly for reference electrodes and other sensor applications. Screen printing is a suitable coating method.	View Product Details
XJK-0497	Silver chloride paste for biosensors	Biosensors Small Components Electrode	One Component Flexible Bending Resistant Long Potlife	Silver Silver chloride ratio = 40:60 Suitable mainly for electrodes of blood glucose level sensors such as CGM. Screen printing is a suitable coating method.	View Product Details
XJS-3050	Conductive Adhesive	Semiconductor Modules Car Electro Devices General Modules Die Attach Solar Batterys	One Component Low Temperature Curing	Low temperature [90～100℃] curable, one component type conductive adhesive [Curing condition: 100℃ 60minutes]	View Product Details
XJS-3060-1	Conductive Adhesive	Semiconductor Modules Car Electro Devices General Modules Die Attach Solar Batterys	One Component Fast Curing	One-component conductive adhesive capable of rapid curing [150°C, 2 minutes].	View Product Details
XM-5866	Resin for Car Electro Devices & Sensors　 One Component Type Resin	Car Electro Devices Sensors, Relays General Modules Varistors, Thermistors	One Component Flame Resistant (UL-94 V-0)	Low viscosity, Fast curable, UL-94 V-0 recongnized	View Product Details
XM-5866 TYPE E3	Resin for Car Electro Devices & Sensors　 One Component Type Resin	Car Electro Devices Sensors, Relays General Modules Varistors, Thermistors	One Component High Thermal Conductivity	High Thermal Conductivity, One Component Type	View Product Details
XM-5896T	Resin for Car Electro Devices & Sensors　 One Component Type Resin Sealing for Thermostat & Relay	Car Electro Devices Sensors, Relays Thermal Fuses General Modules	One Component	Proven performance as encapsulants for years in relay industry. It emits low outgas during curing.	View Product Details
XW-2310	Undercoating Resin for Capacitors	Prastic Magnets Binders	One Component Low Stress Heat Resistant Moisture Resistant	Used for magnetic powder binder and moisture-proof insulating paint.	View Product Details
YC-107B	Potting Resin for Semiconductors One Component Type Resin	Semiconductor Modules General Modules	One Component	Low viscosity, used for COB with dam	View Product Details
ZC-203TI	Potting Resin for Semiconductors One Component Type Resin	Semiconductor Modules General Modules	One Component Flame Resistant (UL-94 V-0)	Appropriate thixotropy, Used for COB without dam	View Product Details
ZC-206	Potting Resin for Semiconductors One Component Type Resin	Semiconductor Modules General Modules	One Component Low Stress Low Curing Shrinkage Low Warpage Heat Cycle Resistant	Low thermal expansion, Low stress, used for COB	View Product Details
ZC-210	Potting Resin for Semiconductors One Component Type Resin	Semiconductor Modules General Modules	One Component Low Stress Low Curing Shrinkage Low Warpage	Resin for COB with low linear expansion and high heat resistance for thin film curing.	View Product Details

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