Product List
search result use:General Modules
29 applicable
Product Name | product category | by use | by function | remark | |
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AG-1A/AG-1B-2 |
Resin for Car Electro Devices & Sensors
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Room temperature curing and fast curing type resin. | View Product Details |
AT17-S |
UV Curable Resins
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White colored UV-curable protective coating with moderate softness at room temperature so that it can be applied to flexible substrates. | View Product Details |
K-3100 |
Electrically conductive Paste for Circuit Patterns
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Suitable mainly for conductive circuits on capacitive touch panels. | View Product Details |
K-3105 |
Electrically conductive Paste for Circuit Patterns
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Suitable mainly for conductive circuits on resistive touch panels. | View Product Details |
K-3107S |
Electrically conductive Paste for Circuit Patterns
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Suitable mainly for conductive circuits on resistive touch panels. | View Product Details |
K-3330 |
Electrically conductive Paste for Circuit Patterns
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Capable of forming fine line circuits by screen printing. Mainly suitable for conductive circuits on capacitive touch panels. | View Product Details |
ME-105/HY-332 |
Resin for Car Electro Devices & Sensors
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Low vicosity, Heat resistant | View Product Details |
ME-105/HY-680 |
Resin for Car Electro Devices & Sensors
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Low vicosity, Heat resistant | View Product Details |
ME-113/XH-1859-2 |
Resin for Car Electro Devices & Sensors
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Flexible and excellent heat resistance. | View Product Details |
ME-352/HV-132 |
Resin for Car Electro Devices & Sensors
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Low viscosity, Fast curable, UL-94 V-0 recongnized | View Product Details |
ME-352/HY-332 |
Resin for Car Electro Devices & Sensors
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Short-time curing, room temperature curing, UL 94 V-0 equivalent grade. | View Product Details |
ME-372/HY-680 |
Resin for Car Electro Devices & Sensors
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Compatible with medium temperature curing, UL 94 V-0 certified grade. | View Product Details |
ME-5031 LC |
Resin for Car Electro Devices & Sensors
One Component Type Resin
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Standard one-component epoxy products with moderate thixotropy and excellent storage stability. | View Product Details |
ME-5064 |
Resin for Car Electro Devices & Sensors
One Component Type Resin
Environmentally Friendly Resin
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Excellent adhesion to various metals and excellent storage stability. | View Product Details |
ME-5131 LC |
Resin for Car Electro Devices & Sensors
One Component Type Resin
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Strong adhesion strength to SUS and CFRP. | View Product Details |
MG-152/HY-336 |
Resin for Car Electro Devices & Sensors
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Room-temperature curable, flexible type resin | View Product Details |
S-3021A/B |
Conductive Adhesive
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Two-component conductive adhesive that can be cured at room temperature.[Curing conditions: 25°C for 16 hours or 100°C for 30 minutes.] | View Product Details |
XA-1295/HQ-1 |
Terminal Seal for Thermal Fuse
Sealing for Thermostat & Relay
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- | Moderate flowability and thixotropic properties. | View Product Details |
XJS-3050 |
Conductive Adhesive
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Low temperature [90~100℃] curable, one component type conductive adhesive [Curing condition: 100℃ 60minutes] | View Product Details |
XJS-3060-1 |
Conductive Adhesive
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One-component conductive adhesive capable of rapid curing [150°C, 2 minutes]. | View Product Details |
XM-2109/XY-2110 |
Resin for Car Electro Devices & Sensors
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UL-94 V-0 recognized, Flexible | View Product Details |
XM-2437/HY-690 |
Resin for Car Electro Devices & Sensors
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Proven performance for years in automotive industry. Excellent heat resistance and heat cycle resistance. | View Product Details |
XM-5866 |
Resin for Car Electro Devices & Sensors
One Component Type Resin
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Low viscosity, Fast curable, UL-94 V-0 recongnized | View Product Details |
XM-5866 TYPE E3 |
Resin for Car Electro Devices & Sensors
One Component Type Resin
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High Thermal Conductivity, One Component Type | View Product Details |
XM-5896T |
Resin for Car Electro Devices & Sensors
One Component Type Resin
Sealing for Thermostat & Relay
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Proven performance as encapsulants for years in relay industry. It emits low outgas during curing. | View Product Details |
YC-107B |
Potting Resin for Semiconductors
One Component Type Resin
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Low viscosity, used for COB with dam | View Product Details |
ZC-203TI |
Potting Resin for Semiconductors
One Component Type Resin
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Appropriate thixotropy, Used for COB without dam | View Product Details |
ZC-206 |
Potting Resin for Semiconductors
One Component Type Resin
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Low thermal expansion, Low stress, used for COB | View Product Details |
ZC-210 |
Potting Resin for Semiconductors
One Component Type Resin
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Resin for COB with low linear expansion and high heat resistance for thin film curing. | View Product Details |
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